FREMONT, Calif. --- ASAT Holdings Limited and ASAT Inc. -- providers of innovative solutions in integrated circuit (IC) package design, assembly and test -- and Honeywell (HON) today announced that ASAT will provide packaging and testing solutions for Honeywell's RF/Microwave product family, including radio transceivers, digital attenuators and RF switches.
ASAT's Leadless Plastic Chip Carrier (LPCC) packages and test services enable Honeywell customers to achieve maximum performance, while providing ease of manufacturing. Current LPCC packages supplied to Honeywell are reaching the MSL-1 level, eliminating the need for dry storage or baking of the package after exposure to air.
"We selected ASAT for its LPCC packaging system and turn-key solutions to complement our advanced RF product solutions," said Grenville Hughes, product line manager, RF/Microwave Solutions. "By using ASAT's innovative packaging, we are confident we will meet customer needs for high accuracy, speed and low power consumption."
"We are extremely pleased to have been selected by Honeywell to provide high speed LPCC packages and testing, and look forward to a long-term relationship with current and future programs," said Harry Rozakis, CEO of ASAT Holdings Ltd. "Honeywell's decision to use ASAT as its supplier further validates our commitment to delivering innovative designs and solutions to enhance our customers time to revenue."
ASAT's LPCC delivers smaller, faster, cooler, more flexible, adaptable, and reliable package options. The LPCC is ideal for high-speed applications such as wireless and portable computing devices, where electrical performance and form factor are critical. The unique package enhances reliability compared to alternative package options, since it achieves very low inductance for high-speed applications. The LPCC also uses die pad soldering to achieve excellent thermal performance and is MSL-1 qualified.
Honeywell's Radio On a Chip transceivers are ideally suited for battery powered wireless applications in conjunction with microprocessors for data communications. Direct microprocessor connections for control and data transfer eliminate the need for large numbers of off-chip components. The first in a series of products, HRF-ROC093XC is assembled in a 7 mm x 7 mm 48-pin LPCC package.
SOI CMOS technology is used to manufacture digital attenuator ICs for use in higher performance 3G wireless infrastructure and broadband communication applications. Digital attenuators are assembled into 4x4 mm 16 to 24L LPCC packages for these products: AT4510, AT4511, AT4520, AT4521, AT4610, and AT4611.
SOI CMOS technology is used to manufacture RF switch ICs for use in highest performance basestations and broadband communication applications. The switches feature integrated CMOS control logic and ESD protection, operate from a single positive supply voltage, have exceptionally high isolation resistance and operate in frequency ranges normally the domain GaAs-based products. The switches are assembled into 3x3 mm 12L & 4x4 mm 20L, 24L LPCC for these products: HRF-SW1000, HRF-SW1001, HRF-SW1020, HRF-SW1021, HRF-SW1030, & HRF-SW1031.
ASAT Holdings Limited is a leader in advanced integrated circuit package designs and has provided outsource assembly and test services for the semiconductor industry for over ten years. The company assembles a broad selection of advanced leaded and ball grid array (BGA) packages utilizing advanced technology characterized by higher electrical and thermal performance. The company also has multi-chip module and flip-chip assembly lines, and offers testing for complex broadband mixed-signal and system-on-a-chip devices used in communications. ASAT is the first packaging company to develop Moisture Sensitive Level One (MSL-1) capability on leaded products.
ASAT has facilities and offices in Asia, Europe, and across the U.S., with major manufacturing facilities in Asia.
The Honeywell Solid State Electronics Center, located in Plymouth, Minnesota of the USA, develops and manufacturers high reliability, high performance integrated circuits, sensors, and electronic components for a variety of commercial and military applications.
Honeywell is a US$24-billion diversified technology and manufacturing leader, serving customers worldwide with aerospace products and services; control technologies for buildings, homes and industry; automotive products; specialty chemicals; fibers; plastics; and electronic and advanced materials. Honeywell employs approximately 115,000 people in 95 countries and is traded on the New York Stock Exchange under the symbol HON, as well as on the London, Chicago and Pacific stock exchanges.
-ends- ASAT Provides Turn-Key Solution To Honeywell For RF/Microwave Product Family
